IC & Sensor Packaging Technology Expo (Packaging Technologies for Semiconductors, LED, MEMS, Sensors) takes place in Tokyo, Japan from to at Tokyo Big Sight. Trade show is organized by Reed Exhibitions Japan.
Reed Exhibitions Japan
Tokyo Big Sight
3-21-1 Ariake, Koto-ku, Tokyo 135-0063
For more information on IC & Sensor Packaging Technology Expo
please visit the fair's information site: