IC & Sensor Packaging Technology Expo

Packaging Technologies for Semiconductors, LED, MEMS, Sensors

January 15-17, 2020, Tokyo, Japan
Tokyo Big Sight
( already closed )

IC & Sensor Packaging Technology Expo (Packaging Technologies for Semiconductors, LED, MEMS, Sensors) takes place in Tokyo, Japan from to at Tokyo Big Sight. Trade show is organized by Reed Exhibitions Japan.

Takes place every year

Organizer: Reed Exhibitions Japan


Tokyo Big Sight
3-21-1 Ariake, Koto-ku, Tokyo 135-0063
For more information on IC & Sensor Packaging Technology Expo
please visit the fair's information site:
www.icp-expo.jp chevron_right

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